Digi XBee® and ConnectCore® Modules Available at BRESSNER

BRESSNER Technology Extends Cooperation with Manufacturer Digi International!

BRESSNER Technology GmbH, one of the leading system integrators and value-added distributor for industrial IT solutions, announces today that it is expanding its current collaboration with the renowned manufacturer Digi International.

As a result, BRESSNER extends its existing product portfolio of industrial networking and IoT solutions with a wide range of embedded modules.

“As a long-standing partner of Digi International, BRESSNER Technology enjoys a high level of customer confidence in the European region when it comes to wireless industrial connectivity,” explains Martin Stiborski, Managing Director of BRESSNER Technology.

“The expansion of our cooperation simplifies future project development, certification, manufacturing, and integration of holistic IoT applications into existing structures. Customers will also benefit from development kits, local technical advice and support for all Digi XBee® and ConnectCore® modules.”

XBee® RF Modules, Cellular Modems, Gateways, and Software Tools

The Digi XBee® Ecosystem is a series of freely programmable embedded modules that allow wireless communication to be integrated into any framework. These include RF modules with various WiFi and Bluetooth protocols and form factors operating in the 868 MHz to 2.4 GHz range.

XBee® Cellular Modems, for OEM devices with older cellular standards such as 3G HSPA or GSM, will be available in the future, as well as industrial gateways and certified RF modems for remote monitoring of production facilities.

Additionally, customers will receive support throughout the entire XBee® product life cycle with developer tools, MicroPython libraries, visualization, quality assurance, integration, and remote management.

Complete Embedded Edge Computing Platforms

With the System-on-Modules of the Digi ConnectCore® series, BRESSNER Technology offers various wireless solutions, including 802.11a/b/g/n/ac, Bluetooth® 5 and mobile radio communication options.

The SOMs are based on NXP i.MX 8X, NXP i.MX6UL or NXP i.MX6 processor structures and support embedded Android and Linux developer environments including Yocto Project. The edge computing platforms contain out-of-the-box software components that enable the realization of cloud services, machine learning as well as image-, video- and audio processing applications.

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